	US 12,346,022 B2
	Method of fabricating pellicle structure
Mun Ja Kim, Hwaseong-si (KR); Ji Beom Yoo, Seoul (KR); Ki Bong Nam, Suwon-si (KR); Jin Ho Yeo, Suwon-si (KR); Changyoung Jeong, Yongin-si (KR); and Qicheng Hu, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., (KR); and Research & Business Foundation SUNGKYUNKWAN UNIVERSITY, (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 20, 2022, as Appl. No. 17/933,769.
Claims priority of application No. 10-2022-0026288 (KR), filed on Feb. 28, 2022.
Prior Publication US 2023/0273515 A1, Aug. 31, 2023
Int. Cl. G03F 1/62 (2012.01); G03F 7/00 (2006.01)

CPC G03F 1/62 (2013.01) [G03F 7/70983 (2013.01)]

20 Claims

1. A method of fabricating a pellicle structure, the method comprising:

forming a metal layer on a temporary substrate;

forming a membrane on the metal layer;

submerging the temporary substrate, the metal layer, and the membrane in a solution;

exposing a bottom surface of the metal layer by physically separating the temporary substrate from the metal layer in the solution; and

exposing a bottom surface of the membrane by etching the bottom surface of the metal layer.