US 12,345,783 B2
Magnetic sensor device and magnetic encoder
Yongfu Cai, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jul. 6, 2023, as Appl. No. 18/347,768.
Claims priority of application No. 2022-112420 (JP), filed on Jul. 13, 2022.
Prior Publication US 2024/0019507 A1, Jan. 18, 2024
Int. Cl. G01R 33/09 (2006.01); G01D 5/14 (2006.01)
CPC G01R 33/091 (2013.01) [G01D 5/142 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A magnetic sensor device comprising:
a magnetic sensor configured to detect a target magnetic field including a magnetic field component in a first direction;
a die pad supporting the magnetic sensor; and
a plurality of leads, wherein
the magnetic sensor includes a bridge circuit including a plurality of arms and a plurality of pads electrically connected to the bridge circuit, the plurality of arms being each constituted of a plurality of magnetic detection elements and configured such that a resistance changes according to change of strength of the magnetic field component,
each of the plurality of arms is configured to have sensitivity to the magnetic field component with strength changing according to a position in the first direction while not having sensitivity to an external magnetic field with strength and a direction being same irrespective of the position in the first direction,
each of the plurality of pads is electrically connected to one corresponding lead among the plurality of leads,
the plurality of pads include a first pad, a second pad, and a third pad,
the plurality of arms include a first arm provided between the first pad and the second pad in circuit configuration and a second arm provided between the second pad and the third pad in circuit configuration, and
the magnetic sensor further includes a first sub-pad electrically connected between one end and another end of the first arm and electrically connected to the die pad.