US 12,345,666 B2
Multi-physical field measurement device for metal solidification process and housing thereof, and measurement method
Jiao Zhang, Shanghai (CN); Yang Tang, Shanghai (CN); Ya Zhang, Shanghai (CN); Yue Wu, Shanghai (CN); Hui Xing, Shanghai (CN); Baode Sun, Shanghai (CN); Yanfeng Han, Shanghai (CN); Yongbing Dai, Shanghai (CN); Chaopeng Fu, Shanghai (CN); and Qing Dong, Shanghai (CN)
Assigned to SHANGHAI JIAOTONG UNIVERSITY, Shanghai (CN)
Appl. No. 18/017,001
Filed by SHANGHAI JIAOTONG UNIVERSITY, Shanghai (CN)
PCT Filed Jun. 11, 2021, PCT No. PCT/CN2021/099844
§ 371(c)(1), (2) Date Jan. 19, 2023,
PCT Pub. No. WO2022/022115, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 202010735899.7 (CN), filed on Jul. 27, 2020.
Prior Publication US 2023/0314349 A1, Oct. 5, 2023
Int. Cl. G01N 23/207 (2018.01); G01J 5/061 (2022.01); G01N 23/20033 (2018.01); G01N 23/223 (2006.01); G01T 1/20 (2006.01); G01J 5/00 (2022.01)
CPC G01N 23/2076 (2013.01) [G01J 5/061 (2013.01); G01N 23/20033 (2013.01); G01N 23/223 (2013.01); G01T 1/20187 (2020.05); G01J 2005/0077 (2013.01); G01J 2005/063 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multi-physical field measurement device for a metal solidification process, comprising:
a sealed housing, provided with a light-through hole for allowing an external X-ray to be emitted into an inside of the housing;
a heater, provided inside the housing, located behind the light-through hole along the X-ray, and configured for heating a to-be-detected sample;
a diffraction detector, configured for receiving the X-ray which penetrates through the sample and is scattered;
a CMOS camera, located behind the heater along the X-ray and configured for receiving a visible light signal which penetrates through the sample;
a silicon drift X-ray detector, located at one side of the X-ray and configured for receiving a fluorescent signal sent by interaction between the X-ray and the sample; and
an infrared thermal imager, located at the other side of the X-ray and configured for receiving an infrared signal sent by the sample;
wherein the multi-physical field measurement device performs a measurement method which comprising following steps of:
heating the to-be-detected sample by the heater, adjusting the X-ray to be emitted into the inside of the housing through the light-through hole and to irradiate the sample, converting the X-ray penetrating through the sample into the visible light signal, receiving the visible light signal by the CMOS camera, to obtain an image of dendritic crystal morphology of the sample solidification process;
the diffraction detector receiving the X-ray which penetrates through the sample and is scattered, so as to realize qualitative analysis, lattice constant determination and stress measurement of a matter structure;
the infrared thermal imager receiving the infrared signal sent by the sample to realize temperature measurement of a sample micro region; and
the silicon drift X-ray detector receiving the fluorescent signal sent by interaction between the X-ray irradiated on the sample and the sample to realize quantitative measurement of element ingredient of the sample.