US 12,345,579 B2
Stress monitoring device, stress monitoring system, and monitoring system
Hiroshi Michiwaki, Tokyo (JP)
Assigned to NEXT INNOVATION INC., Tokyo (JP)
Appl. No. 17/626,784
Filed by NEXT INNOVATION INC., Tokyo (JP)
PCT Filed Jul. 8, 2020, PCT No. PCT/JP2020/026756
§ 371(c)(1), (2) Date Jan. 12, 2022,
PCT Pub. No. WO2021/010263, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 2019-130717 (JP), filed on Jul. 12, 2019.
Prior Publication US 2022/0252473 A1, Aug. 11, 2022
Int. Cl. G01L 1/22 (2006.01); G06N 3/08 (2023.01)
CPC G01L 1/22 (2013.01) [G06N 3/08 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A stress monitoring device comprising:
an information acquisition unit configured to acquire measured information concerning deformation or strain applied to a member constituting a structure;
a memory configured to store associated stress information configured by associating the measured information with design information of the structure and disposition information;
a calculation unit configured to calculate stress distribution information on stress distribution acting on all or part of the structure from the associated stress information;
a trainer configured to generate a machine learning model for calculating the stress distribution information from the associated stress information by the calculation unit and manage parameters of the machine learning model;
an analyzer configured to analyze the associated stress information to acquire analyzed stress distribution information of the stress distribution of the structure; and
a determination unit configured to compare the stress distribution information by the machine learning model and the analyzed stress distribution information by the analyzer and determine a degree of agreement; and
wherein the trainer is configured to perform machine learning using the analyzed stress distribution information as training data so as to improve the degree of agreement by the determination unit and update the parameters.