US 12,345,569 B2
SPAD-based photodetectors
Massimo Cataldo Mazzillo, Hamburg (DE)
Assigned to AMS-OSRAM INTERNATIONAL GMBH, Regensburg (DE)
Appl. No. 17/797,457
Filed by ams-OSRAM International GmbH, Regensburg (DE)
PCT Filed Feb. 5, 2021, PCT No. PCT/EP2021/052817
§ 371(c)(1), (2) Date Aug. 4, 2022,
PCT Pub. No. WO2021/156444, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 10 2020 201 452.3 (DE), filed on Feb. 6, 2020.
Prior Publication US 2023/0080013 A1, Mar. 16, 2023
Int. Cl. G01J 1/42 (2006.01); G01J 1/44 (2006.01)
CPC G01J 1/4228 (2013.01) [G01J 2001/4466 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor avalanche photodiode for light detection, the avalanche photodiode comprising:
a p-n junction comprising a first shallow extrinsic semiconductor layer with a first type of doping embedded in a second well-shaped extrinsic semiconductor layer with a second type of doping opposite to the first type of doping;
a first electric contact configured to electrically connect the first semiconductor layer;
a second electric contact configured to electrically connect the second semiconductor layer;
an avalanche region at the interface between the two semiconductor layers configured to undergo avalanche breakdown when triggered by the light to be detected; and
a dielectric isolation trench extending into the second well-shaped semiconductor layer and surrounding an outer periphery of the avalanche region to prevent premature edge breakdown in the avalanche photodiode;
wherein the isolation trench is arranged, in a radial direction, in-between the first electric contact and the second electric contact;
wherein:
the isolation trench comprises an encasement made of a dielectric material and a metallic core surrounded by the dielectric encasement; and
the thickness of the isolation trench is greater than or equal to 90% of the thickness of the second well-shaped semiconductor layer, the isolation trench thus forming a deep trench isolation within the second well-shaped semiconductor layer.