US 12,345,549 B2
Composite molded component
Hironobu Yamamoto, Yokkaichi (JP); Kyungwoo Kim, Yokkaichi (JP); Toshinari Kobayashi, Yokkaichi (JP); and Yukitoshi Terasaka, Yokkaichi (JP)
Assigned to Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
Appl. No. 18/040,765
Filed by Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
PCT Filed Jul. 30, 2021, PCT No. PCT/JP2021/028279
§ 371(c)(1), (2) Date Feb. 6, 2023,
PCT Pub. No. WO2022/030377, PCT Pub. Date Feb. 10, 2022.
Claims priority of application No. 2020-134789 (JP), filed on Aug. 7, 2020.
Prior Publication US 2023/0280192 A1, Sep. 7, 2023
Int. Cl. G01D 11/24 (2006.01); G01D 11/16 (2006.01)
CPC G01D 11/245 (2013.01) [G01D 11/16 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A composite molded component comprising:
an inner molded portion; and
an outer molded portion that covers the inner molded portion,
wherein an anti-rotation detent hole, which is open at a surface of the inner molded portion, is formed in the inner molded portion,
a through hole that extends from a surface of the outer molded portion to the anti-rotation detent hole is formed in the outer molded portion,
the anti-rotation detent hole is a hole that is delimited by an inner peripheral surface and a bottom surface, and
at least part of the inner peripheral surface is formed in a non-circular shape.