| CPC G01D 11/245 (2013.01) [F28F 27/00 (2013.01); G01D 11/30 (2013.01)] | 19 Claims |

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1. A sensor, comprising: a housing, a circuit board, and a sensor chip fixed on the circuit board;
wherein a material of the housing is metal, the housing defines a receiving cavity and a first channel extending through the housing, and the first channel is in fluid communication with the receiving cavity and an outside of the sensor;
wherein the circuit board is at least partially received in the receiving cavity, and at least a part of the circuit board is bonded and fixed to the housing by a thermal conductive glue; and
wherein the sensor chip is adapted for sensing at least one of a humidity signal and a temperature signal of an environment in the receiving cavity;
the housing comprises a top wall, a bottom wall, a side wall and a second channel extending through the housing; the side wall is provided on an outer peripheral side of the receiving cavity; the side wall connects the top wall and the bottom wall; at least a part of the bottom wall forms as a concave wall, a center of the concave wall is recessed inwardly relative to an edge of the concave wall toward the top wall, and the second channel is closer to the side wall than the center of the concave wall.
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