US 12,345,522 B2
Computer system, dimension measurement method, and storage medium
Yutaka Okuyama, Tokyo (JP); and Takeshi Ohmori, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 17/802,673
Filed by HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
PCT Filed Jun. 14, 2021, PCT No. PCT/JP2021/022456
§ 371(c)(1), (2) Date Aug. 26, 2022,
PCT Pub. No. WO2022/264195, PCT Pub. Date Dec. 22, 2022.
Prior Publication US 2024/0200939 A1, Jun. 20, 2024
Int. Cl. G01B 21/04 (2006.01); G06T 7/00 (2017.01); G06T 7/60 (2017.01); H01J 37/22 (2006.01)
CPC G01B 21/04 (2013.01) [G06T 7/0006 (2013.01); G06T 7/60 (2013.01); H01J 37/222 (2013.01); G01B 2210/56 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/2817 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A computer system for providing a function for: extracting, from image data of a semiconductor pattern, coordinate information about a base point for measuring a dimension of a desired location of the semiconductor pattern; and measuring the dimension using the coordinate information of the base point,
the computer system comprising a training device in which a pose estimation model for outputting the coordinate information of at least two of the base points as a training result is implemented,
wherein the training device is trained in advance using teacher data having image data of the semiconductor pattern as an input and the coordinate information of the at least two base points as an output,
the computer system, with respect to new image data input into the training device, extracting the coordinate information of the at least two base points and the dimension.