US 12,345,480 B2
Cooling device for heat treatment
Soo Jin Chung, Seoul (KR); Won Ki Chung, Seoul (KR); Jun Yong Park, Seoul (KR); Young Min Shin, Namyangju-si (KR); and Hyeon Seung Lee, Ansan-si (KR)
Assigned to DONGWOO HST CO., LTD., Siheung-si (KR)
Filed by DONGWOO HST CO., LTD., Asan-si (KR); and Winner vacuum Solution Co., Ltd., Siheung-si (KR)
Filed on Dec. 7, 2023, as Appl. No. 18/532,517.
Claims priority of application No. 10-2022-0189887 (KR), filed on Dec. 29, 2022.
Prior Publication US 2024/0219130 A1, Jul. 4, 2024
Int. Cl. F28F 25/06 (2006.01); C21D 1/667 (2006.01); F28F 5/00 (2006.01); F28F 25/00 (2006.01)
CPC F28F 25/06 (2013.01) [C21D 1/667 (2013.01); F28F 5/00 (2013.01); F28F 2025/005 (2013.01); F28F 2280/10 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A cooling device for heat treatment, the cooling device comprising:
a chamber to which a plurality of objects is charged through one open side thereof;
an individual cooling unit configured to be provided in the chamber, to individually cover the object, and to spray a cooling medium onto the object; and
a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction.