| CPC F28D 15/06 (2013.01) [F28D 15/0233 (2013.01); F28D 15/0275 (2013.01)] | 15 Claims |
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1. A method comprising:
operating a first processor unit of a plurality of processor units of an integrated circuit component at a first power level, the plurality of processor units located in an integrated circuit component; and
operating the first processor unit at a second power level, the first power level lesser than the second power level, the integrated circuit component physically coupled to a variable conductance heat pipe (VCHP), the VCHP comprising a first exterior surface and a second exterior surface, the first exterior surface and the second exterior surface being substantially parallel to each other and located opposite from each other, the VCHP located between the integrated circuit component and a cold plate, the VCHP directly attached to the cold plate at the first exterior surface, the direct attachment of the VCHP to the cold plate associated with a first area, the VCHP physically coupled to the integrated circuit component at the second exterior surface, the physical coupling of the VCHP to the integrated circuit component associated with a second area that at least partially overlaps the first area, the VCHP to allow a first rate of heat transfer between the integrated circuit component and the cold plate when the first processor unit is operated at the first power level and a second rate of heat transfer between the integrated circuit component and the cold plate when the first processor unit is operated at the second power level, the first rate of heat transfer less than the second rate of heat transfer.
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