US 12,344,739 B2
Conductive epoxy resin composition for copper bonding
Yang Ti, Shanghai (CN); Wei Yao, Shanghai (CN); Qili Wu, Shanghai (CN); and Jiawen Zhao, Shanghai (CN)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Jan. 13, 2023, as Appl. No. 18/096,648.
Application 18/096,648 is a continuation in part of application No. PCT/CN2020/101576, filed on Jul. 13, 2020.
Prior Publication US 2023/0174773 A1, Jun. 8, 2023
Int. Cl. H01B 1/22 (2006.01); C08L 63/00 (2006.01)
CPC C08L 63/00 (2013.01) [H01B 1/22 (2013.01); C08L 2203/20 (2013.01)] 16 Claims
 
1. A conductive epoxy resin composition comprising:
(A) at least one epoxy resin system comprising,
(A1) at least one epoxy resin having at least two glycidyloxy group-containing aromatic groups bonded to each other by a divalent endocyclic hydrocarbon group or an aryl group, and optionally a C1 to C6 alkylene group; and
(A2) at least one resorcinol diglycidyl ether resin present in an amount of from 0.2 to 5.0% by weight, based on the total weight of the composition;
(B) at least one acid anhydride curing agent;
(C) optionally, at least one solvent;
(D) at least one conductive filler; and
(E) optionally, at least one catalyst.