US 12,344,738 B2
Resin composition, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
Kosuke Okuno, Osaka (JP); and Masaya Koyama, Mie (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Apr. 25, 2024, as Appl. No. 18/646,300.
Application 18/646,300 is a continuation of application No. PCT/JP2022/041663, filed on Nov. 9, 2022.
Claims priority of application No. 2021-188798 (JP), filed on Nov. 19, 2021.
Prior Publication US 2024/0279458 A1, Aug. 22, 2024
Int. Cl. C08L 53/00 (2006.01); C08L 71/12 (2006.01); C09D 153/00 (2006.01); C09D 171/12 (2006.01); H05K 1/03 (2006.01)
CPC C08L 53/00 (2013.01) [C08L 71/12 (2013.01); C09D 153/00 (2013.01); C09D 171/12 (2013.01); H05K 1/0373 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A resin composition containing
a polyphenylene ether compound (A),
a styrene block copolymer (B),
a polybutadiene compound (C),
a curing agent (D), and
a silane coupling agent (E) having a triazine ring,
the polyphenylene ether compound (A) having, in a molecule thereof, at least one of a group expressed by the following formula (1) or a group expressed by the following formula (2):

OG Complex Work Unit Chemistry
where p indicates an integer falling within a range from 0 to 10, Z indicates an arylene group, and R1 to R3 each independently indicate either a hydrogen atom or an alkyl group,

OG Complex Work Unit Chemistry
where R4 indicates either a hydrogen atom or an alkyl group,
the polybutadiene compound (C) having an epoxy group in a molecule thereof, and
the curing agent (D) containing an allyl compound (d1) expressed by the following formula (3):

OG Complex Work Unit Chemistry
where RA indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.