US 12,344,710 B2
Semi-crystalline copolyamides, moulding compounds comprising same and their use, and mouldings manufactured from same
Philipp Harder, Chur (CH); Christian Schubert, Domat/Ems (CH); and Ronny Ebling, Domat/Ems (CH)
Assigned to EMS-Patent AG, Domat/Ems (CH)
Filed by EMS-PATENT AG, Domat/Ems (CH)
Filed on Aug. 7, 2020, as Appl. No. 16/987,913.
Claims priority of application No. 19191021 (EP), filed on Aug. 9, 2019.
Prior Publication US 2021/0040264 A1, Feb. 11, 2021
Int. Cl. C08G 69/26 (2006.01); C08K 7/14 (2006.01)
CPC C08G 69/265 (2013.01) [C08K 7/14 (2013.01); C08G 2250/00 (2013.01)] 15 Claims
 
1. A semi-crystalline copolyamide formed from the following monomers (a1) to (a5):
(a1) 23 to 37.5 mol % 1,6-hexanediamine;
(a2) 12.5 to 22 mol % 1,3-bis(aminomethyl)cyclohexane;
(a3) 0 to 5 mol % at least one diamine selected from the group consisting of ethylenediamine, butanediamine, pentanediamine, methylpentanediamine, 1,8-octanediamine, methyloctanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecaneamine, trimethyl hexamethylenediamine, m-xylylenediamine, and p-xylylenediamine;
(a4) 45 to 50 mol % 1,6-hexanedioic acid; and
(a5) 0 to 5 mol % at least one dicarboxylic acid with 2 to 44 carbon atoms, differing from monomer (a4);
wherein the proportions of the monomers (a1), (a2), and (a3) are with respect to the sum of the diamines utilized and add up to 50 mol %;
wherein the proportions of the monomers (a4) and (a5) are with respect to the sum of the dicarboxylic acids utilized and add up to 50 mol %;
wherein the monomers (a1) to (a5) add up to 100 mol %;
wherein the copolyamide has a melting temperature in the range from 180 to 235° C.; and
when the semi-crystalline copolyamide is combined with a filler to form a moulding compound, the resulting moulding compound would have a modulus of elasticity in accordance with ISO 527 of at least 5000 MPa.