US 12,344,028 B2
Envelope processing apparatus, enclosing-sealing apparatus, and image forming system
Nobuyoshi Suzuki, Tokyo (JP); Michitaka Suzuki, Kanagawa (JP); Yuusuke Shibasaki, Tokyo (JP); Makoto Hidaka, Tokyo (JP); Akira Kunieda, Tokyo (JP); Takahiro Watanabe, Kanagawa (JP); Takuya Morinaga, Tokyo (JP); Takahiro Matsuda, Kanagawa (JP); Shingo Yoshizawa, Kanagawa (JP); Shinji Asami, Tokyo (JP); and Kazuyoshi Matsuo, Miyagi (JP)
Assigned to Ricoh Company, Ltd., Tokyo (JP)
Appl. No. 18/548,295
Filed by Nobuyoshi Suzuki, Tokyo (JP); Michitaka Suzuki, Kanagawa (JP); Yuusuke Shibasaki, Tokyo (JP); Makoto Hidaka, Tokyo (JP); Akira Kunieda, Tokyo (JP); Takahiro Watanabe, Kanagawa (JP); Takuya Morinaga, Tokyo (JP); Takahiro Matsuda, Kanagawa (JP); Shingo Yoshizawa, Kanagawa (JP); Shinji Asami, Tokyo (JP); and Kazuyoshi Matsuo, Miyagi (JP)
PCT Filed May 6, 2022, PCT No. PCT/IB2022/054191
§ 371(c)(1), (2) Date Aug. 29, 2023,
PCT Pub. No. WO2022/238829, PCT Pub. Date Nov. 17, 2022.
Claims priority of application No. 2021-080478 (JP), filed on May 11, 2021; application No. 2021-098141 (JP), filed on Jun. 11, 2021; and application No. 2022-030084 (JP), filed on Feb. 28, 2022.
Prior Publication US 2024/0140132 A1, May 2, 2024
Int. Cl. B43M 5/00 (2006.01); B43M 5/04 (2006.01)
CPC B43M 5/042 (2013.01) 20 Claims
OG exemplary drawing
 
1. An envelope processing apparatus for enclosing an enclosure in an envelope, the apparatus comprising:
an envelope conveyance path extending in a vertical direction, the envelope conveyance path configured to convey an envelope;
an enclosure supplier configured to supply an enclosure to the envelope via the envelope conveyance path;
an envelope supplier configured to supply the envelope to the envelope conveyance path;
a flap opener configured to open a flap portion of the envelope between the envelope supplier and the envelope conveyance path;
an envelope stacker configured to stack the envelope ejected from the envelope conveyance path; and
an envelope supply path branching from the envelope conveyance path at a first branch position lower than a position of the enclosure supplier in the envelope conveyance path.