US 12,343,991 B2
Processing method and processing apparatus
Hideki Okada, Shiojiri (JP); Hirokazu Sekino, Chino (JP); and Osamu Katsuda, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Jul. 12, 2023, as Appl. No. 18/350,906.
Claims priority of application No. 2022-112710 (JP), filed on Jul. 13, 2022.
Prior Publication US 2024/0017548 A1, Jan. 18, 2024
Int. Cl. B41J 2/14 (2006.01); B41J 3/407 (2006.01); B41J 11/00 (2006.01)
CPC B41J 2/14201 (2013.01) [B41J 3/4078 (2013.01); B41J 11/0024 (2021.01)] 6 Claims
OG exemplary drawing
 
1. A processing method comprising:
a liquid ejecting step of ejecting liquid toward a fabric from an ejecting nozzle hole of a liquid ejecting section and causing the liquid to strike the fabric, the liquid ejecting section including at least one nozzle, the at least one nozzle including the ejecting nozzle hole and a liquid inflow port serving as an inlet to the ejecting nozzle hole; and
a vibration application step of applying vibration to the fabric subjected to the liquid ejecting step, wherein
0.01 mm≤d≤0.30 mm and 5≤D/d≤150,
where d [mm] is a diameter of the ejecting nozzle hole and D [mm] is a diameter of the liquid inflow port.