US 12,343,926 B2
Device and method for embossing a component
Klaus Hassdenteufel, Gerlingen (DE); Stefan Schill, Renningen (DE); and Daniel Schleicher, Esslingen Neckar (DE)
Assigned to MAHLE International GmbH, (DE)
Filed by MAHLE International GmbH, Stuttgart (DE)
Filed on Jul. 13, 2023, as Appl. No. 18/221,846.
Application 18/221,846 is a division of application No. 16/821,989, filed on Mar. 17, 2020, granted, now 11,738,500.
Claims priority of application No. 102019203632.5 (DE), filed on Mar. 18, 2019.
Prior Publication US 2024/0083100 A1, Mar. 14, 2024
Int. Cl. B29C 59/02 (2006.01); B29C 59/00 (2006.01); B29L 31/18 (2006.01)
CPC B29C 59/022 (2013.01) [B29C 59/005 (2013.01); B29L 2031/18 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device, comprising:
at least a first component and a second component,
the first component having at least a first surface portion and a second surface portion,
the first surface portion and the second surface portion located opposite to one another with respect to a wall thickness of the first component and spaced apart from one another with respect to the wall thickness of the first component,
the first component including a first support groove provided at least in some sections at the first surface portion, the first support groove having a depth in a direction of the wall thickness of the first component,
the first component further including a functional groove provided at the first surface portion, the functional groove having a depth in a direction of the wall thickness of the first component,
wherein the functional groove is arranged spaced apart from the first support groove at least in some sections,
wherein the functional groove is structured and arranged for partially receiving the second component for a substance-to-substance bond, and
wherein the functional groove is embossed into the first component and has a different cross sectional shape from that of the first support groove.