US 12,343,881 B2
Equipment front end module and destructive analysis automation apparatus including the same
Youn Gon Oh, Hwaseong-si (KR); Sae Yun Ko, Hwaseong-si (KR); Gil Ho Gu, Hwaseong-si (KR); Dong Su Kim, Incheon (KR); Ji Hun Kim, Uiwang-si (KR); Sang Hyuk Park, Yongin-si (KR); Eun Hee Lee, Hwaseong-si (KR); Ho Chan Lee, Seoul (KR); Seong Sil Jeong, Incheon (KR); and Seong Pyo Hong, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 1, 2022, as Appl. No. 17/711,261.
Claims priority of application No. 10-2021-0128434 (KR), filed on Sep. 29, 2021.
Prior Publication US 2023/0107043 A1, Apr. 6, 2023
Int. Cl. B25J 9/16 (2006.01); G05B 19/418 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01)
CPC B25J 9/1687 (2013.01) [G05B 19/41875 (2013.01); H01L 21/67294 (2013.01); H01L 21/67333 (2013.01); H01L 21/67736 (2013.01); H01L 21/67742 (2013.01); H01L 21/67769 (2013.01); G05B 2219/45031 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An equipment front end module (EFEM) comprising:
a base configured to communicate with a processor;
a tray port on the base, the tray port being configured to load a tray comprising a stub and a grid holder;
a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray; and
a shuttle port on the base, the shuttle port comprising a first groove configured to fix the stub, and a second groove configured to fix the grid holder,
wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.
 
10. A destructive analysis automation apparatus comprising:
a main device configured to perform a semiconductor destructive analysis; and
an equipment front end module (EFEM) which is connected to a side of the main device,
wherein the EFEM comprises:
a tray port configured to load a tray comprising a stub and a grid holder;
a shuttle port configured to fix the stub and the grid holder, the shuttle port being loaded in the main device; and
a working robot configured to convey the stub, the grid holder, and the shuttle port,
wherein the working robot is further configured to grasp the stub in the tray and the grid holder in the tray and convey the stub and the grid holder to the shuttle port, and
wherein the working robot is further configured to grasp the shuttle port and loads the shuttle port into the main device.
 
18. A destructive analysis automation apparatus comprising:
a first main device configured to perform a pre-processing to form test wafer pieces and store the test wafer pieces in a stub;
a second main device configured to perform a sample fabrication to fabricate a test sample and store the test sample in a grid holder;
a first equipment front end module (EFEM) on a side of the first main device; and
a second EFEM provided on a side of the second main device,
wherein the first EFEM comprises:
a first tray port configured to load a tray comprising the stub;
a first shuttle port configured to fix the stub; and
a first working robot configured to convey the stub from the tray to the first shuttle port and convey the first shuttle port to the first main device, and
wherein the second EFEM comprises:
a second tray port configured to load a tray comprising the grid holder;
a second shuttle port configured to fix the grid holder; and
a second working robot configured to convey the grid holder from the tray to the second shuttle port, and convey the second shuttle port to the second main device.