US 12,343,840 B2
Control of processing parameters for substrate polishing with substrate precession
Eric Lau, Santa Clara, CA (US); Charles C. Garretson, Monterey, CA (US); Huanbo Zhang, San Jose, CA (US); Zhize Zhu, Cupertino, CA (US); Benjamin Cherian, San Jose, CA (US); Brian J. Brown, Palo Alto, CA (US); and Thomas H. Osterheld, Mountain View, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 25, 2022, as Appl. No. 17/681,673.
Claims priority of provisional application 63/157,606, filed on Mar. 5, 2021.
Prior Publication US 2022/0283554 A1, Sep. 8, 2022
Int. Cl. H01L 21/67 (2006.01); B24B 37/005 (2012.01); B24B 49/00 (2012.01); B24B 49/12 (2006.01); B24B 49/16 (2006.01); G05B 13/04 (2006.01)
CPC B24B 37/005 (2013.01) [B24B 49/006 (2013.01); B24B 49/12 (2013.01); B24B 49/16 (2013.01); G05B 13/041 (2013.01); G05B 13/047 (2013.01); H01L 21/67092 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A computer program product for generating a recipe for controlling a polishing system, the computer program product encoded on a non-transitory computer readable medium and comprising instructions for causing one or more computers to:
receive a target thickness profile that includes a target thickness for a plurality of locations spaced angularly around a center of a substrate;
store a first function providing substrate orientation relative to a carrier head over time;
store a second function defining a polishing rate below a pressurizable zone from a plurality of pressurizable zones of the carrier head as a function of one or more pressures of one or more zones from the plurality of pressurizable zones of the carrier head, the plurality of pressurizable zones spaced angularly around an axis of rotation of the carrier head;
for each particular zone of the plurality of zones, calculate a recipe defining a pressure for the particular zone over time, wherein the instructions to calculate the recipe include instructions to calculate an expected thickness profile after polishing from the second function defining the polishing rate and the first function providing substrate orientation relative to the zone over time, and instructions to apply a minimizing algorithm to reduce a difference between the expected thickness profile and the target thickness profile; and
cause the carrier head to apply, for each pressurizable zone of the plurality of zones, the pressure over time as defined by the recipe.