US 12,343,820 B2
Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body
Maki Yonetsu, Mitaka (JP); Seiichi Suenaga, Yokohama (JP); Sachiko Fujisawa, Kawasaki (JP); and Takashi Sano, Fujisawa (JP)
Assigned to KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA MATERIALS CO., LTD., Yokohama (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA MATERIALS CO., LTD., Yokohama (JP)
Filed on May 27, 2022, as Appl. No. 17/826,493.
Application 17/826,493 is a continuation of application No. PCT/JP2021/004956, filed on Feb. 10, 2021.
Claims priority of application No. 2020-024184 (JP), filed on Feb. 17, 2020.
Prior Publication US 2022/0288726 A1, Sep. 15, 2022
Int. Cl. B23K 1/00 (2006.01); B23K 35/30 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); C04B 37/02 (2006.01); C22C 30/02 (2006.01); H05K 3/38 (2006.01); B23K 101/42 (2006.01); B23K 103/00 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01)
CPC B23K 35/3006 (2013.01) [B23K 1/0016 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 37/023 (2013.01); C22C 30/02 (2013.01); H05K 3/388 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); C04B 2237/125 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); H05K 2203/04 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A brazing material for bonding a ceramic substrate and a copper plate,
wherein when a total of raw elements is taken as 100 mass %, the brazing material comprises:
more than 0 mass % and not more than 75 mass % of Ag;
not less than 15 mass % and not more than 85 mass % of Cu;
not less than 1 mass % and not more than 15 mass % of one or two of Ti or TiH2;
not less than 1 mass % and not more than 50 mass % of either Sn or In; and
not less than 0 mass % and not more than 2 mass % of C,
a mass ratio of Ag to Cu being not more than 1.3,
a mass ratio of Sn to Ag or a mass ratio of In to Ag being not less than 0.25,
wherein
an average grain size D50 of Ag is less than an average grain size D50 of Cu, and
the average grain size D50 of Ag is less than an average grain size D50 of Sn or In,
wherein when using a differential scanning calorimeter (DSC) a DSC curve is measured, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process and one or both of an endothermic peak or an exothermic peak within a range of not less than 140° C. and not more than 300° C. in the heating process.