| CPC B23K 26/144 (2015.10) [B22F 10/22 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B23K 26/0608 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B22F 12/45 (2021.01); B23K 2101/001 (2018.08); B23K 2103/04 (2018.08); B33Y 70/00 (2014.12); F01D 25/24 (2013.01)] | 11 Claims |

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1. A method for additive manufacturing by depositing material on a part forming a substrate, the said part forming a substrate being made of a metal alloy, the method comprising the steps of:
forming a base layer by low-energy deposition, corresponding to a surface energy of less than 400 J/mm2, on a predefined surface to be deposited, and
depositing a wire on the base layer by high-energy deposition, corresponding to a surface energy greater than 500 J/mm2, thereby forming one or more additional layers,
the base layer providing a shielding effect that mitigates the thermal impact of the step of the depositing a wire on the base layer by high-energy deposition on the substrate part.
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