| CPC B08B 3/02 (2013.01) [B08B 2240/00 (2013.01); H01L 21/02052 (2013.01); H01L 21/67005 (2013.01)] | 18 Claims |
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1. A cleaning device comprising:
a substrate rotation mechanism that holds a substrate and rotates the substrate around a center axis of the substrate as a rotation axis;
a first single-tube nozzle that discharges a first cleaning liquid toward a top surface of the substrate held by the substrate rotation mechanism; and
a second single-tube nozzle that discharges a second cleaning liquid toward the top surface of the substrate held by the substrate rotation mechanism separately from the first single-tube nozzle,
wherein the first single-tube nozzle is configured to discharge the first cleaning liquid along a first line, the first line extending from the first single-tube nozzle to a first location on the top surface of the substrate, the first location being on a first radius of the top surface of the substrate a first distance before a center of the substrate in a direction to the edge of the substrate in alignment with the first single-tube nozzle, the discharge causing a first liquid flow of the first cleaning liquid on the top surface of the substrate after landing, the first liquid flow passing from the first location through the center of the substrate, and
wherein the second single-tube nozzle is configured to discharge the second cleaning liquid along a second line, the second line extending from the second single-tube nozzle to a second location on the top surface of the substrate, the second location being on a second radius of the top surface of the substrate a second distance from the center of the substrate toward the outer edge of the substrate, the second distance being greater than the first distance, and the second line extending from the second nozzle in a same direction as a direction of a rotation of the substrate and in a direction where the second line forms a first angle with a third line extending from the center of the substrate to the second location when viewed in a plan view from above, the second discharge causing a second liquid flow of the second cleaning liquid on the top surface of the substrate after the second cleaning liquid lands on the substrate and causing a portion of the first liquid flow and a portion of the second liquid flow to combine, and
wherein the third line forms an obtuse second angle with a fourth line extending from the center of the substrate to the first location on a downstream side of the first location in the direction of rotation of the substrate.
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