US 12,343,684 B2
Filter apparatus for semiconductor device fabrication process
Chwen Yu, Hsinchu (TW); En Tian Lin, Hsinchu (TW); Chih-Chiang Tseng, Hsinchu (TW); and Tzu-Sou Chuang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 2, 2023, as Appl. No. 18/229,556.
Application 18/229,556 is a division of application No. 17/333,499, filed on May 28, 2021, granted, now 11,826,709.
Prior Publication US 2023/0372878 A1, Nov. 23, 2023
Int. Cl. B01D 67/00 (2006.01); B01D 63/08 (2006.01); B01D 69/02 (2006.01); B01D 69/06 (2006.01); H01L 21/67 (2006.01)
CPC B01D 67/0034 (2013.01) [B01D 63/08 (2013.01); B01D 67/0037 (2013.01); B01D 67/0088 (2013.01); B01D 69/02 (2013.01); B01D 69/06 (2013.01); H01L 21/67017 (2013.01); B01D 2323/34 (2013.01); B01D 2325/02 (2013.01); B01D 2325/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a filter membrane, the method comprising:
forming a sacrificial layer over a substrate;
forming a plurality of pillars over the substrate by a lithography process using a photomask placed over and separated from the sacrificial layer, wherein the lithography process includes applying exposure light through the photomask and patterning the sacrificial layer to form the plurality of pillars;
forming a polymer layer over the substrate with the plurality of pillars;
removing the plurality of pillars to form a plurality of through holes in the polymer layer; and
detaching the polymer layer with the plurality of through holes from the substrate.