| CPC A61N 1/3754 (2013.01) [H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01G 4/236 (2013.01); H01G 4/35 (2013.01)] | 23 Claims |

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1. An implantable medical device (IMD), the IMD comprising:
a) a ceramic base comprising a sidewall defining an open space and extending to a base annular edge surrounding a base open end;
b) a ceramic lid closing the open end of the ceramic base, the lid extending to a lid annular edge meeting a lid device side spaced from a lid body fluid side, wherein at least a lid first conductive pathway extends to spaced apart lid first conductive pathway device and body fluid side ends, and a lid second conductive pathway extends to spaced apart lid second conductive pathway device and body fluid side ends;
c) a circuit board residing in the interior space of the ceramic base closed by the lid, the circuit board extending to spaced apart circuit board first and second sides, wherein a circuit board first conductive pathway extends to spaced apart circuit board first conductive pathway first and second ends adjacent to the respective circuit board first and second sides, and a circuit board second conductive pathway extends to spaced apart circuit board second conductive pathway first and second ends adjacent to the respective circuit board first and second sides;
d) at least one electronic component supported by the circuit board, the electronic component having a first terminal spaced from a second terminal, wherein the circuit board first and second conductive pathway second ends are electrically connected to the respective first and second terminals of the at least one electronic component; and
e) an anisotropic conductive layer disposed between the circuit board first side and the device side of the ceramic lid, the anisotropic conductive layer comprising an electrically insulative matrix supporting a plurality of electrically conductive particles, wherein the anisotropic conductive layer comprises:
i) a first thickness that is longitudinally aligned with the lid first conductive pathway device side end and the circuit board first conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the first thickness has at least a first one of the plurality of electrically conductive particles in electrical contact with the lid first conductive pathway device side end and the circuit board first conductive pathway first end to thereby provide electrical continuity from the lid first conductive pathway body fluid side end to the circuit board first conductive pathway second end electrically connected to the first terminal of the at least one electronic component;
ii) a second thickness that is longitudinally aligned with the lid second conductive pathway device side end and the circuit board second conductive pathway first end adjacent to the circuit board first side, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the second thickness has at least a second one of the plurality of electrically conductive particles in electrical contact with the lid second conductive pathway device side end and the circuit board second conductive pathway first end to thereby provide electrical continuity from the lid second conductive pathway body fluid side end to the circuit board second conductive pathway second end electrically connected to the second terminal of the at least one electronic component; and
iii) a third thickness that is greater than the first and second thicknesses where the lid and circuit board first conductive pathways are not longitudinally aligned and where the lid and circuit board second conductive pathways are not longitudinally aligned, wherein, even though the electrically conductive matrix supporting the plurality of electrically conductive particles resides in the third thickness, a third one of the plurality of electrically conductive particles is not in electrical contact with either of the lid first conductive pathway and the circuit board first conductive pathway, and with either of the lid second conductive pathway and the circuit board second conductive pathway,
iv) wherein the third, greater thickness of the anisotropic conductive layer electrically isolates at least the first and second ones of the plurality of electrically conductive particles from each other.
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