US 12,343,539 B2
Implant comprising embedded conductor track and production method
Eckardt Bihler, Uitikon (CH); Marc Hauer, Uster (CH); and Dirk Muessig, West Linn, OR (US)
Assigned to Dyconex AG, Bassersdorf (CH)
Filed by DYCONEX AG, Bassersdorf (CH)
Filed on Aug. 22, 2022, as Appl. No. 17/892,184.
Application 17/892,184 is a continuation of application No. 16/972,072, granted, now 11,446,503, previously published as PCT/EP2019/067373, filed on Jun. 28, 2019.
Claims priority of application No. 10 2018 211 186.3 (DE), filed on Jul. 6, 2018.
Prior Publication US 2022/0395688 A1, Dec. 15, 2022
Int. Cl. A61N 1/36 (2006.01); A61N 1/372 (2006.01); A61N 1/375 (2006.01)
CPC A61N 1/36125 (2013.01) [A61N 1/37211 (2013.01); A61N 1/375 (2013.01); A61N 1/37512 (2017.08); A61N 1/3754 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An implant comprising:
a substrate made of thermoplastic;
a housing made of thermoplastic, wherein the housing is disposed on the substrate;
a hermetic seal joining the housing and substrate together, wherein the hermetic seal is formed via heating and melting an interface of the substrate and the housing;
a diffusion barrier comprising a metal layer applied to the housing and substrate;
an electronic circuit disposed on the substrate inside the housing;
an electronic component disposed on the substrate outside the housing;
conductor track, wherein the conductor track connects the electronic circuit to the electronic component;
wherein the conductor track is embedded into the substrate at least in sections so that at least one section of the conductor track is completely surrounded by the substrate.