US 12,343,216 B2
Ultrasound probe
Takayuki Iwashita, Chiba (JP); Hiroshi Hattori, Chiba (JP); Tomohiro Shiraishi, Chiba (JP); Hidetsugu Katsura, Chiba (JP); Wataru Sawada, Chiba (JP); and Sachio Shimada, Chiba (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Aug. 14, 2023, as Appl. No. 18/233,723.
Claims priority of application No. 2022-131778 (JP), filed on Aug. 22, 2022.
Prior Publication US 2024/0057981 A1, Feb. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 8/00 (2006.01); B06B 1/06 (2006.01)
CPC A61B 8/546 (2013.01) [A61B 8/4488 (2013.01); B06B 1/0622 (2013.01); B06B 2201/76 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An ultrasound probe, comprising:
a transducer array;
an electronic circuit provided behind the transducer array and electrically connected to the transducer array;
a first backing provided behind the electronic circuit and configured to attenuate ultrasound waves from the transducer array; and
a second backing provided behind the first backing and configured to further attenuate the ultrasound waves from the transducer array,
wherein assuming that a direction in which the transducer array, the electronic circuit, the first backing, and the second backing are arranged is defined as a Z direction, a direction perpendicular to the Z direction is defined as an X direction, and a direction perpendicular to the Z direction and the X direction is defined as a Y direction,
in the first backing, both of Z-direction thermal conductivity and X-direction thermal conductivity are higher than Y-direction thermal conductivity, and
in the second backing, both of Z-direction thermal conductivity and Y-direction thermal conductivity are higher than X-direction thermal conductivity.