US 12,022,697 B2
Display panel, display apparatus, and method of fabricating the display panel
Ming Yang, Beijing (CN); Can Zhang, Beijing (CN); Minghua Xuan, Beijing (CN); Chuanxiang Xu, Beijing (CN); Feng Zhang, Beijing (CN); Zhongyuan Sun, Beijing (CN); and Xiaochuan Chen, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
Filed on May 23, 2022, as Appl. No. 17/751,456.
Application 17/751,456 is a division of application No. 16/639,114, granted, now 11,374,074, previously published as PCT/CN2019/110168, filed on Oct. 9, 2019.
Claims priority of application No. 201910271162.1 (CN), filed on Apr. 4, 2019.
Prior Publication US 2022/0285467 A1, Sep. 8, 2022
Int. Cl. H10K 59/124 (2023.01); H10K 50/844 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/124 (2023.02) [H10K 50/844 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] 9 Claims
OG exemplary drawing
 
1. A method of fabricating a display panel, comprising:
forming a first conductive layer on a base substrate, wherein the first conductive layer is formed in an encapsulated area and a peripheral area of the display panel, wherein the encapsulated area and the peripheral area are non-overlapping to each other;
forming an organic insulating layer on a side of the first conductive layer away from the base substrate, wherein the organic insulating layer is formed to be limited in the encapsulated area;
forming a first inorganic insulating layer on a side of the organic insulating layer away from the base substrate;
forming a second conductive layer on a side of the organic insulating layer and the first inorganic insulating layer away from the base substrate, wherein the second conductive layer is formed in the encapsulated area and the peripheral area; and
forming a second inorganic insulating layer subsequent to forming the first conductive layer and prior to forming the organic insulating layer, the second inorganic insulating layer formed between the organic insulating layer and the first conductive layer;
wherein forming the first inorganic insulating layer comprises forming first inorganic insulating sub-layer in the peripheral area, and a second inorganic insulating sub-layer in the encapsulated area;
the first inorganic insulating layer is formed between the first conductive layer and the second conductive layer;
the organic insulating layer is formed prior to forming the first inorganic insulating layer;
the first inorganic insulating layer covers the organic insulating layer; and
an orthographic projection of the first conductive layer on the base substrate at least partially overlaps with an orthographic projection of the second conductive layer on the base substrate.