CPC H10K 59/124 (2023.02) [H10K 50/844 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] | 9 Claims |
1. A method of fabricating a display panel, comprising:
forming a first conductive layer on a base substrate, wherein the first conductive layer is formed in an encapsulated area and a peripheral area of the display panel, wherein the encapsulated area and the peripheral area are non-overlapping to each other;
forming an organic insulating layer on a side of the first conductive layer away from the base substrate, wherein the organic insulating layer is formed to be limited in the encapsulated area;
forming a first inorganic insulating layer on a side of the organic insulating layer away from the base substrate;
forming a second conductive layer on a side of the organic insulating layer and the first inorganic insulating layer away from the base substrate, wherein the second conductive layer is formed in the encapsulated area and the peripheral area; and
forming a second inorganic insulating layer subsequent to forming the first conductive layer and prior to forming the organic insulating layer, the second inorganic insulating layer formed between the organic insulating layer and the first conductive layer;
wherein forming the first inorganic insulating layer comprises forming first inorganic insulating sub-layer in the peripheral area, and a second inorganic insulating sub-layer in the encapsulated area;
the first inorganic insulating layer is formed between the first conductive layer and the second conductive layer;
the organic insulating layer is formed prior to forming the first inorganic insulating layer;
the first inorganic insulating layer covers the organic insulating layer; and
an orthographic projection of the first conductive layer on the base substrate at least partially overlaps with an orthographic projection of the second conductive layer on the base substrate.
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