CPC H05K 1/181 (2013.01) [H05K 1/111 (2013.01); H05K 3/24 (2013.01); H05K 3/284 (2013.01); H05K 3/3442 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H05K 2201/094 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10515 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1322 (2013.01)] | 16 Claims |
1. A printed circuit board comprising:
a substrate comprising a first set of contact pads and a first set of contact pillars integrally formed of the same material thereon on a second set of contact pads, wherein the first set of contact pillars have a height greater than the first set of contact pads and wherein a width of the first set of contact pillars is narrower than a width of the second set of contact pads such that the first set of contact pillars are positioned at a midpoint of the width of the second set of contact pads;
a first component coupled to the first set of contact pads along a first direction, the first component having a first side facing the first set of contact pads, and a second side opposite the first side; and
a second component coupled to the first set of contact pillars along a second direction, wherein the second direction traverses the first direction, the second component having a first side facing the first set of contact pads, and a second side opposite the first side;
wherein the second component is positioned above the first component such that at least a first portion of the second side of the first component faces the first side of the second component.
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