US 12,022,610 B2
Controlled wetting and spreading of metals on substrates using porous interlayers and related articles
Jason Dale Nicholas, Okemos, MI (US); Quan Zhou, Farmington Hills, MI (US); and Thomas Rector Bieler, East Lansing, MI (US)
Assigned to BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY, East Lansing, MI (US)
Filed by BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY, East Lansing, MI (US)
Filed on Feb. 10, 2022, as Appl. No. 17/668,660.
Application 17/668,660 is a division of application No. 16/386,576, filed on Apr. 17, 2019, granted, now 11,284,510.
Claims priority of provisional application 62/658,659, filed on Apr. 17, 2018.
Prior Publication US 2022/0167501 A1, May 26, 2022
Int. Cl. H05K 1/03 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 3/1208 (2013.01); H05K 3/22 (2013.01); H05K 3/3478 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A patterned, wetted substrate comprising:
(a) a substrate;
(b) a bulk patterned second metal layer adjacent to the substrate, the bulk patterned second metal layer comprising a second metal and a first metal, the first metal being at a lower concentration than the second metal in the bulk patterned second metal layer; and
(c) an interfacial layer between the bulk patterned second metal layer and the substrate, the interfacial layer comprising the first metal and the second metal;
wherein:
the second metal has a lower melting point than that of the first metal;
the interfacial layer comprises porous portions of the first metal defining pores therein, the pores ranging in size from 0.005 μm to 50 μm;
the pores of the porous portions contain the second metal infiltrated therein, the second metal infiltrated in the pores ranging in size from 0.005 μm to 50 μm;
the second metal is bonded to and is in contact with the substrate via the porous portions of the first metal in the interfacial layer;
the interfacial layer has a thickness in a range of 0.01 μm to 250 μm; and
the bulk patterned second metal layer and the interfacial layer have a combined thickness in a range of 0.1 μm to 1000 μm.