CPC H05K 1/0306 (2013.01) [H05K 3/1208 (2013.01); H05K 3/22 (2013.01); H05K 3/3478 (2013.01)] | 20 Claims |
1. A patterned, wetted substrate comprising:
(a) a substrate;
(b) a bulk patterned second metal layer adjacent to the substrate, the bulk patterned second metal layer comprising a second metal and a first metal, the first metal being at a lower concentration than the second metal in the bulk patterned second metal layer; and
(c) an interfacial layer between the bulk patterned second metal layer and the substrate, the interfacial layer comprising the first metal and the second metal;
wherein:
the second metal has a lower melting point than that of the first metal;
the interfacial layer comprises porous portions of the first metal defining pores therein, the pores ranging in size from 0.005 μm to 50 μm;
the pores of the porous portions contain the second metal infiltrated therein, the second metal infiltrated in the pores ranging in size from 0.005 μm to 50 μm;
the second metal is bonded to and is in contact with the substrate via the porous portions of the first metal in the interfacial layer;
the interfacial layer has a thickness in a range of 0.01 μm to 250 μm; and
the bulk patterned second metal layer and the interfacial layer have a combined thickness in a range of 0.1 μm to 1000 μm.
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