US 12,022,180 B2
Array camera module and application thereof
Mingzhu Wang, Zhejiang (CN); Bojie Zhao, Zhejiang (CN); Zhenyu Chen, Zhejiang (CN); Nan Guo, Zhejiang (CN); and Takehiko Tanaka, Nara (JP)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed on Sep. 29, 2021, as Appl. No. 17/488,876.
Application 17/488,876 is a continuation of application No. 16/472,425, granted, now 11,165,941, previously published as PCT/CN2017/118337, filed on Dec. 25, 2017.
Claims priority of application No. 201611207393.9 (CN), filed on Dec. 23, 2016; application No. 201710214811.5 (CN), filed on Apr. 1, 2017; application No. 201710214886.3 (CN), filed on Apr. 1, 2017; application No. 201710214887.8 (CN), filed on Apr. 1, 2017; application No. 201720344605.1 (CN), filed on Apr. 1, 2017; application No. 201720344964.7 (CN), filed on Apr. 1, 2017; and application No. 201720346336.2 (CN), filed on Apr. 1, 2017.
Prior Publication US 2022/0021792 A1, Jan. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/57 (2023.01); G01N 15/06 (2024.01); G03B 17/02 (2021.01); H04M 1/02 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)
CPC H04N 23/57 (2023.01) [G01N 15/0656 (2013.01); G03B 17/02 (2013.01); H04M 1/0264 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)] 13 Claims
OG exemplary drawing
 
1. An array camera module, comprising at least two optical lenses and a circuit board assembly, wherein the circuit board assembly further comprises:
one circuit board;
at least two photosensitive chips, wherein at least one of the photosensitive chips is conductively connected to a front surface of the circuit board, and at least one other of the photosensitive chips is accommodated in at least one accommodation space implemented as a through-hole in the circuit board, each of the optical lenses is held in a photosensitive path of each of the photosensitive chips respectively, and there is a height difference between a photosensitive surface of at least one of the photosensitive chips and a photosensitive surface of at least one other of the photosensitive chips;
at least one electronic component, wherein each of the electronic components is conductively connected to the circuit board respectively, and at least one of the electronic components is located on a back face of the circuit board; and
an embedding portion which is integrally bonded to the back face of the circuit board,
wherein the embedding portion is formed by solidifying a fluid-state molding material which is added into a lower molding space between the circuit board and a lower die by filling up the lower molding space through a lower communication channel and performing a demolding operation of the lower die.