US 12,021,215 B2
Conductive paste for electrode mixed material layer, slurry for electrode mixed material layer, electrode for electrochemical device, and electrochemical device
Kenya Sonobe, Tokyo (JP); Yasuhiro Isshiki, Tokyo (JP); and Maki Mesuda, Tokyo (JP)
Assigned to ZEON CORPORATION, Tokyo (JP)
Appl. No. 17/279,758
Filed by ZEON CORPORATION, Tokyo (JP)
PCT Filed Oct. 3, 2019, PCT No. PCT/JP2019/039167
§ 371(c)(1), (2) Date Mar. 25, 2021,
PCT Pub. No. WO2020/075626, PCT Pub. Date Apr. 16, 2020.
Claims priority of application No. 2018-191983 (JP), filed on Oct. 10, 2018.
Prior Publication US 2022/0037632 A1, Feb. 3, 2022
Int. Cl. H01M 4/36 (2006.01); H01M 4/04 (2006.01)
CPC H01M 4/0416 (2013.01) [H01M 4/364 (2013.01)] 9 Claims
 
1. A conductive paste for an electrode mixed material layer comprising:
a conductive additive;
a polymer in a proportional content of not less than 3 parts by mass and not more than 200 parts by mass per 100 parts by mass of the conductive additive; and
expandable particles in a proportional content of not less than 12 parts by mass and not more than 350 parts by mass per 100 parts by mass of the conductive additive, wherein
the polymer includes at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an amino group, an epoxy group, an oxazoline group, a sulfo group, a nitrile group, an ester group, and an amide group,
the expandable particles have an initial thermal decomposition temperature of not lower than 120° C. and not higher than 400° C.,
the conductive paste has a water content of 1,000 ppm or less,
the conductive paste does not comprise an electrode active material, and
the conductive paste has a solid content concentration of not less than 3 mass % and not more than 50 mass %.