US 12,021,097 B2
Camera module, and photosensitive component thereof and manufacturing method therefor
Mingzhu Wang, Ningbo (CN); Bojie Zhao, Ningbo (CN); Takehiko Tanaka, Ningbo (CN); Zhongyu Luan, Ningbo (CN); Zhenyu Chen, Ningbo (CN); and Zhen Huang, Ningbo (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed on Jun. 23, 2022, as Appl. No. 17/847,569.
Application 17/847,569 is a division of application No. 16/082,533, abandoned, previously published as PCT/CN2017/076041, filed on Mar. 9, 2017.
Claims priority of application No. 201610142925.9 (CN), filed on Mar. 12, 2016; application No. 201610143457.7 (CN), filed on Mar. 12, 2016; application No. 201620191631.0 (CN), filed on Mar. 12, 2016; application No. 201620191969.6 (CN), filed on Mar. 12, 2016; application No. 201610202500.2 (CN), filed on Apr. 1, 2016; application No. 201620269534.9 (CN), filed on Apr. 1, 2016; application No. 201610278035.0 (CN), filed on Apr. 28, 2016; application No. 201620373323.X (CN), filed on Apr. 28, 2016; application No. 201610430615.7 (CN), filed on Jun. 16, 2016; and application No. 201620590779.1 (CN), filed on Jun. 16, 2016.
Prior Publication US 2023/0019091 A1, Jan. 19, 2023
Int. Cl. H01L 23/10 (2006.01); H01L 27/146 (2006.01); H04N 23/55 (2023.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 23/10 (2013.01); H01L 27/14621 (2013.01); H01L 27/14698 (2013.01); H04N 23/55 (2023.01); H05K 1/0274 (2013.01); H05K 1/118 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/16195 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An array camera module, comprising:
at least two camera modules, wherein each of the camera modules is independent from others, and the at least two camera modules coordinate with each other to conduct the image capturing of the array camera module, wherein each of the camera modules comprises:
a photosensitive unit, comprising:
an encapsulation portion;
a photosensitive portion, including a main circuit board and a photosensitive sensor, wherein the encapsulation portion is encapsulated to form on the main circuit board and the photosensitive sensor and has a window defined by an inclined inner wall of the encapsulation portion and positioned above the photosensitive sensor to provide a light path of the photosensitive sensor; and
a protective layer arranged on the main circuit board around an area of the photosensitive sensor; and
a camera lens, located in the photosensitive path of the photosensitive sensor of the photosensitive unit;
wherein the encapsulation portions of the at least two camera modules are integrally connected, so as to form a conjoined encapsulation portion.