CPC H01L 27/127 (2013.01) [H01L 27/0288 (2013.01); H01L 27/124 (2013.01); H10K 59/1201 (2023.02); G02F 1/136204 (2013.01); H01L 27/1225 (2013.01); H10K 59/1315 (2023.02)] | 8 Claims |
1. A method of manufacturing an array substrate, comprising:
providing a base;
forming a plurality of conductive lines on the base;
forming an oxide semiconductor film on a side of the plurality of conductive lines away from the base, the oxide semiconductor film covering the plurality of conductive lines and being in direct contact with at least one conductive line, and the at least one conductive line being configured to discharge static electricity generated in the oxide semiconductor film; and
patterning the oxide semiconductor film by using a photoetching process to remove a portion of the oxide semiconductor film that is in direct contact with the at least one conductive line, and form an oxide semiconductor layer including active layers of a plurality of oxide thin film transistors, the oxide semiconductor layer and the at least one conductive line being insulated from each other.
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