US 12,021,060 B2
Reducing keep-out-zone area for a semiconductor device
Kevin Du, Shanghai (CN); Hope Chiu, Shanghai (CN); Zengyu Zhou, Shanghai (CN); Alex Zhang, Shanghai (CN); Vincent Jiang, Shanghai (CN); Shixing Zhu, Shanghai (CN); Paul Qu, Shanghai (CN); Yi Su, Shanghai (CN); and Rui Yuan, Shanghai (CN)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Sep. 22, 2020, as Appl. No. 17/028,484.
Prior Publication US 2022/0093559 A1, Mar. 24, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0652 (2013.01) [H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/3185 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/14511 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19105 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate;
a first component attached to a first major surface of the substrate;
an underfill positioned under and around the first component;
a second component comprising a NAND die attached to the first major surface and spaced from a first side of the first component by a keep-out-zone area, wherein a side surface of the second component facing the first component provides a border to the underfill;
the keep-out-zone area extending from the first side of first component to the side surface of the second component and free of components or printed circuit board (PCB) traces; and
a third component attached to the first major surface of the substrate and located on the substrate in relation to a second side of the first component,
wherein a portion of the underfill covers the keep-out-zone area and tapers from the first component towards the second component,
wherein the underfill is not positioned between the NAND die and the substrate.