US 12,019,289 B2
Communication systems having pluggable modules
Peter Johannes Winzer, Aberdeen, NJ (US); Peter James Pupalaikis, Ramsey, NJ (US); Brett Michael Dunn Sawyer, Pasadena, CA (US); Ron Zhang, Sunnyvale, CA (US); and Clinton Randy Giles, Watchung, NJ (US)
Assigned to Nubis Communications, Inc., Aberdeen, NJ (US)
Filed by Nubis Communications, Inc., Aberdeen, NJ (US)
Filed on Jul. 21, 2023, as Appl. No. 18/224,930.
Application 18/224,930 is a continuation of application No. 17/842,625, filed on Jun. 16, 2022.
Claims priority of provisional application 63/324,429, filed on Mar. 28, 2022.
Claims priority of provisional application 63/316,551, filed on Mar. 4, 2022.
Claims priority of provisional application 63/272,025, filed on Oct. 26, 2021.
Claims priority of provisional application 63/245,559, filed on Sep. 17, 2021.
Claims priority of provisional application 63/245,011, filed on Sep. 16, 2021.
Claims priority of provisional application 63/245,005, filed on Sep. 16, 2021.
Claims priority of provisional application 63/225,779, filed on Jul. 26, 2021.
Claims priority of provisional application 63/223,685, filed on Jul. 20, 2021.
Claims priority of provisional application 63/212,013, filed on Jun. 17, 2021.
Prior Publication US 2023/0358979 A1, Nov. 9, 2023
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01)
CPC G02B 6/4261 (2013.01) [G02B 6/4268 (2013.01); G02B 6/428 (2013.01); G02B 6/4285 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A rackmount server comprising:
a housing having a front panel and a rear panel, in which the front panel defines an opening, and the rear panel is at a first distance from the front panel; and
a substrate that is positioned at a second distance from the front panel, in which the second distance is less than one-third of the first distance, a data processor is mounted on the substrate, the substrate has a main surface that is oriented at an angle in a range of 0 to 45 degrees relative to the front panel;
wherein at least one of (i) the substrate has electrical contacts that are configured to be electrically coupled to electrical contacts of a co-packaged optical module, or (ii) a first module is mounted on the substrate, in which the first module has electrical contacts that are configured to be electrically coupled to electrical contacts of a co-packaged optical module.