CPC G02B 6/1225 (2013.01) [G02B 6/12011 (2013.01); G02B 2006/1213 (2013.01)] | 15 Claims |
1. A package assembly, comprising:
a substrate; and
a semiconductor chip attached to the substrate such that a portion of the semiconductor chip overhangs an edge of the substrate, wherein a v-groove array for receiving a plurality of optical fibers is present within the portion of the semiconductor chip that overhangs the edge of the substrate, wherein the semiconductor chip includes a dam structure formed on the portion of the semiconductor chip that overhangs the edge of the substrate at a location between the v-groove array and the substrate, wherein the dam structure protrudes out from a surface of the semiconductor chip in which the v-groove array is formed, wherein the dam structure extends substantially parallel to the edge of the substrate, wherein the dam structure is spaced apart from the substrate so that a gap exists between the dam structure and the edge of the substrate.
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