US 12,017,406 B2
Three-dimensional printing
Jarrid A. Wittkopf, Palo Alto, CA (US); Kristopher J. Erickson, Palo Alto, CA (US); and Lihua Zhao, Palo Alto, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/288,552
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Apr. 29, 2019, PCT No. PCT/US2019/029705
§ 371(c)(1), (2) Date Apr. 25, 2021,
PCT Pub. No. WO2020/222762, PCT Pub. Date Nov. 5, 2020.
Prior Publication US 2022/0040918 A1, Feb. 10, 2022
Int. Cl. B29C 41/22 (2006.01); B29C 64/112 (2017.01); B29C 64/165 (2017.01); B29C 70/88 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); H01C 17/065 (2006.01); B29C 35/08 (2006.01); B29K 105/16 (2006.01); B29K 505/00 (2006.01); B29L 31/34 (2006.01)
CPC B29C 64/165 (2017.08) [B29C 70/882 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); H01C 17/06526 (2013.01); B29C 2035/0827 (2013.01); B29C 2795/005 (2013.01); B29K 2105/162 (2013.01); B29K 2505/00 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0006 (2013.01); B29K 2995/0007 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3487 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A three-dimensional (3D) printing method, comprising:
identifying an electrical conductivity value for a resistor that is to be 3D printed;
based upon the identified electrical conductivity value, selectively applying a predetermined amount of a conductive agent to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material in the conductive agent to the resistor, wherein the predetermined volume percent of the conductive material ranges from about 0.05 vol % to about 2 vol %, based on a total volume of the resistor;
based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, selectively applying a predetermined amount of a resistive agent to the at least the portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material in the resistive agent to the resistor; and
exposing the build material layer to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.