US 12,342,677 B2
Display device and method for fabricating electronic device by using the same
Heesung Lim, Seoul (KR); Kyoungwoo Park, Hwaseong-si (KR); Seyoon Park, Seoul (KR); Sanghee Choi, Cheonan-si (KR); Minsu Kim, Cheonan-si (KR); Jinhyuk Park, Hwaseong-si (KR); and Jong-Nam Lee, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Aug. 8, 2022, as Appl. No. 17/882,957.
Claims priority of application No. 10-2021-0118644 (KR), filed on Sep. 6, 2021; and application No. 10-2021-0118645 (KR), filed on Sep. 6, 2021.
Prior Publication US 2023/0072104 A1, Mar. 9, 2023
Int. Cl. H10K 50/844 (2023.01); H10K 59/40 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/844 (2023.02) [H10K 59/40 (2023.02); H10K 71/00 (2023.02); H10K 2102/311 (2023.02)] 25 Claims
OG exemplary drawing
 
1. A display device comprising:
a display module comprising a first area including pixels, a second area bent with respect to an imaginary axis extending in a first direction, and a third area, on which a driving chip electrically connected to the pixels is disposed;
a flexible circuit film disposed at at least a portion of the third area of the display module and including a first bottom surface attached to the display module; and
a cover film physically contacting the second area of the display module, at least a portion of a first top surface of the flexible circuit film opposite to the first bottom surface and an entirety of a second top surface of the driving chip opposite to a second bottom surface of the driving chip facing the display module, the cover film including at least two of:
a first cover insulating layer disposed on the second area of the display module, the portion of the first top surface of the flexible circuit film and the second top surface of the driving chip;
an intermediate layer disposed on the first cover insulating layer and overlapping the second area of the display module, the portion of the flexible circuit film and the driving chip; and
a second cover insulating layer disposed on the intermediate layer and overlapping the second area of the display module, the portion of the flexible circuit film and the driving chip.