US 12,342,667 B2
LED module
Hideaki Abe, Tokyo (JP); Kazuyuki Yamada, Tokyo (JP); Keisuke Asada, Tokyo (JP); Kota Uogishi, Tokyo (JP); Kenichi Takemasa, Tokyo (JP); and Daiki Isono, Tokyo (JP)
Assigned to JAPAN DISPLAY INC., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Mar. 17, 2022, as Appl. No. 17/696,927.
Application 17/696,927 is a continuation of application No. PCT/JP2020/031243, filed on Aug. 19, 2020.
Claims priority of application No. 2019-171716 (JP), filed on Sep. 20, 2019.
Prior Publication US 2022/0209081 A1, Jun. 30, 2022
Int. Cl. H01L 33/60 (2010.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/856 (2025.01) [H10H 20/857 (2025.01)] 8 Claims
OG exemplary drawing
 
1. An LED module comprising:
a first layer including a first plane;
an LED chip arranged on the first plane;
a second layer surrounding the LED chip and including a convex part on the first plane; and
a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of an upper surface of the second layer,
wherein
a height of the convex part of the second layer is lower than a height of an upper surface of the LED chip,
the first layer, the second layer and the third layer include conductive films,
the second layer is divided into a plurality of parts and includes a first convex part and a second convex part separated from each other,
a first wiring and a second wiring are arranged between the first convex part and the second convex part on the first plane and are insulated from the third layer, and
the LED chip is electrically connected to the first wiring and the second wiring.