| CPC H10D 30/475 (2025.01) [H01L 21/02192 (2013.01); H01L 21/02194 (2013.01)] | 6 Claims |

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1. An electronic device including an interface between BaSnO3 and LaInO3, the electronic device comprising:
a substrate formed of a metal oxide of non-SrTiO3 material;
a first buffer layer disposed on the substrate and formed of a BaSnO3 material;
a BLSO layer disposed on at least a portion of the first buffer layer and formed of a (Ba1-x,Lax) SnO3 material, wherein x has a value equal to or greater than 0 and less than or equal to 1;
an LIO layer at least partially disposed on at least a portion of the BLSO layer so as to form an interface between the LIO layer and the BLSO layer, and formed of an LaInO3 material; and
a first electrode layer at least partially in contact with the interface between the BLSO layer and the LIO layer, and formed of at least two or more separated portions;
wherein the LIO layer has a thickness between 15 to 17 angstroms.
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