US 12,342,467 B2
Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
Hideo Nakagawa, Omihachiman (JP); Yoshinori Ogawa, Kamakura (JP); Nobuaki Matsumoto, Takasaki (JP); Shuhei Ueda, Joetsu (JP); Keiji Ohori, Saitama (JP); and Kohei Otake, Yokohama (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Appl. No. 17/427,437
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
PCT Filed Dec. 10, 2019, PCT No. PCT/JP2019/048225
§ 371(c)(1), (2) Date Jul. 30, 2021,
PCT Pub. No. WO2020/166184, PCT Pub. Date Aug. 20, 2020.
Claims priority of application No. 2019-022527 (JP), filed on Feb. 12, 2019.
Prior Publication US 2022/0124949 A1, Apr. 21, 2022
Int. Cl. B25B 11/00 (2006.01); H05K 13/04 (2006.01); H10H 20/01 (2025.01)
CPC H05K 13/0452 (2013.01) [H10H 20/018 (2025.01)] 42 Claims
OG exemplary drawing
 
1. A stamp head unit comprising:
a stamp component comprising at least a silicone-based rubber film on a quartz glass substrate;
a stamp-component-holding component comprising a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and
a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component,
wherein the quartz glass substrate does not include through holes in a stamp area.