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1. A method for producing a printed circuit board having at least one embedded electronic component, having the following steps: producing a printed circuit board module having at least one electrically conductive layer and at least one electrically insulating layer, the at least one electrically insulating layer surrounding the electronic component so as to enclose it and the contacts of the electronic component being conductively connected to connection surfaces of the at least one electrically conductive layer, providing a support layer, providing a positioning layer having a recess larger than a corresponding base area of the printed circuit board module, placing the positioning layer on the support layer, inserting the printed circuit board module into the recess in the positioning layer, whereby the printed circuit board module is positioned without soldering or gluing, placing at least one electrically insulating layer on the printed circuit board module and the positioning layer surrounding the printed circuit board module, placing at least another electrically conductive layer on the at least one electrically insulating layer covering the printed circuit board module, pressing of a layer sequence produced by the preceding placing steps to form a pressed layer sequence, making bores in the pressed layer sequence in an area of the connection surfaces of the printed circuit board module extending to at least the connection surfaces, and metallizing the bores.
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