US 12,342,459 B2
Flexible printed wiring board and electric wiring
Shunsuke Aoyama, Tokyo (JP); and Masanori Hirata, Tokyo (JP)
Assigned to MEKTEC CORPORATION, Tokyo (JP)
Filed by MEKTEC CORPORATION, Tokyo (JP)
Filed on Mar. 1, 2023, as Appl. No. 18/177,000.
Claims priority of application No. 2022-073363 (JP), filed on Apr. 27, 2022.
Prior Publication US 2023/0354522 A1, Nov. 2, 2023
Int. Cl. H01R 12/61 (2011.01); H01R 12/62 (2011.01); H01R 12/63 (2011.01); H05K 1/11 (2006.01); H01R 35/02 (2006.01)
CPC H05K 1/118 (2013.01) [H01R 12/61 (2013.01); H01R 12/62 (2013.01); H01R 12/63 (2013.01); H01R 35/025 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09672 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A flexible printed wiring board comprising:
a base film which is an insulating layer;
a first conductor layer;
a second conductor layer; and
a through-hole,
wherein the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and
the through-hole is provided so as to penetrate the first conductor layer, the base film, and the second conductor layer,
a metal plating is continuously disposed on an inner peripheral surface of the through-hole, a horizontal surface of the first conductor layer opposite to the base film side, and a horizontal surface of the second conductor layer opposite to the base film side,
the first conductor layer and the second conductor layer are electrically connected by the metal plating disposed on the inner peripheral surface of the through-hole, and
the second conductor layer has a solderable region.