US 12,342,458 B2
Lead finger for printed circuit board
Uthayarajan A/L Rasalingam, Penang Island (MY); and Muhammad Afif Bin Abu Hussein, Penang Island (MY)
Assigned to Sandisk Technologies, Inc., Milpitas, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on May 12, 2022, as Appl. No. 17/743,393.
Prior Publication US 2023/0371179 A1, Nov. 16, 2023
Int. Cl. H05K 1/11 (2006.01); H01R 12/72 (2011.01)
CPC H05K 1/117 (2013.01) [H01R 12/721 (2013.01); H01R 12/724 (2013.01); H05K 2201/10189 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB), comprising:
a plurality of lead fingers disposed on a body of the PCB, wherein each lead finger comprises:
a first side;
a second side;
a third side, wherein the second side is substantially parallel to the third side;
a fourth side coupled to the second side, wherein the fourth side is disposed at a first angle from the second side;
a fifth side coupled to the third side, wherein the fifth side is disposed at a second angle from the third side;
a groove portion;
a first portion coupled to the groove portion by a first slanted portion; and
a second portion coupled to the groove portion by a second slanted portion.