US 12,342,452 B2
Circuit board and electronic device
Kosuke Kikuchi, Nagaokakyo (JP); and Kosuke Nishio, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jan. 19, 2023, as Appl. No. 18/098,811.
Application 18/098,811 is a continuation of application No. PCT/JP2021/022052, filed on Jun. 10, 2021.
Claims priority of application No. 2020-128597 (JP), filed on Jul. 29, 2020.
Prior Publication US 2023/0156910 A1, May 18, 2023
Int. Cl. H05K 1/02 (2006.01); H01P 3/08 (2006.01); H05K 1/05 (2006.01)
CPC H05K 1/0237 (2013.01) [H01P 3/08 (2013.01); H05K 1/05 (2013.01); H05K 2201/09209 (2013.01); H05K 2201/10015 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a board body;
a signal conductor in the board body and through which a high frequency signal is transmitted;
a power supply conductor in the board body and connected to a power supply potential, the power supply conductor extending along at least a portion of the signal conductor; and
a first reference conductor in the board body is insulated from the signal conductor and the power supply conductor; wherein
the board body includes a plurality of insulator layers that are stacked, and each of the signal conductor, the power supply conductor, and the first reference conductor is inside of the stack of the plurality of insulator layers.