US 12,342,124 B2
Microphone module
Jinyu Zhang, Shenzhen (CN)
Assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed by AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed on May 31, 2023, as Appl. No. 18/327,032.
Application 18/327,032 is a continuation of application No. PCT/CN2023/077285, filed on Feb. 21, 2023.
Prior Publication US 2024/0284093 A1, Aug. 22, 2024
Int. Cl. H04R 1/24 (2006.01); H04R 1/08 (2006.01); H04R 3/00 (2006.01)
CPC H04R 1/245 (2013.01) [H04R 1/086 (2013.01); H04R 3/005 (2013.01); H04R 2410/07 (2013.01); H04R 2499/15 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A microphone module comprising:
a housing having a receiving cavity and a first sound channel penetrating thereon;
a first support member received in the receiving cavity and fixed to the housing;
a first microphone mounted on the first support member and configured to pick up sound signal in full frequency rage; and
a second microphone mounted on the first support member and configured to pick up sound signal in a frequency range of 700-1500 Hz; wherein
a first sound hole corresponding to the first microphone and a second sound hole corresponding to the second microphone are provided on the first support member; the first sound hole and the second sound hole are spaced away from each other; external sound wave entering the first sound channel is transmitted to the first microphone through the first sound hole; external sound wave entering the first sound channel is transmitted to the second microphone through the second sound hole.