US 12,341,933 B2
Transmitting apparatus, receiving apparatus, and transmission system
Tomoki Nakazato, Kanagawa (JP); Yoshiaki Matsubara, Kanagawa (JP); and Hideyuki Someya, Tokyo (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed on Jun. 1, 2023, as Appl. No. 18/204,713.
Application 18/204,713 is a continuation of application No. 17/621,534, granted, now 11,695,883, previously published as PCT/JP2020/019708, filed on May 19, 2020.
Claims priority of application No. 2019-121341 (JP), filed on Jun. 28, 2019.
Prior Publication US 2023/0362307 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 1/00 (2006.01); G06V 10/25 (2022.01); H04N 21/4402 (2011.01); H04N 23/80 (2023.01); H04N 25/68 (2023.01); H04N 25/683 (2023.01); G09G 5/14 (2006.01)
CPC H04N 1/00114 (2013.01) [G06V 10/25 (2022.01); H04N 21/440245 (2013.01); H04N 23/80 (2023.01); H04N 25/68 (2023.01); H04N 25/683 (2023.01); G09G 5/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transmitting apparatus comprising:
transmission circuitry configured to send image data of an image included in a Region Of Interest (ROI) as payload data, and to send defect correction information for use in correcting a defect in the image included in the ROI, the defect correction information being sent as embedded data.