US 12,341,778 B2
Di chip, smartphone, system, and operating method
Howard Hong-Dough Lee, Bloomfield Hills, MI (US)
Filed by Howard Hong-Dough Lee, Bloomfield Hills, MI (US)
Filed on Sep. 13, 2023, as Appl. No. 18/368,006.
Prior Publication US 2025/0088510 A1, Mar. 13, 2025
Int. Cl. H04L 29/00 (2006.01); H04L 9/40 (2022.01)
CPC H04L 63/10 (2013.01) [H04L 63/1441 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A chip for enabling DI (device identification) communication, comprising:
(a) input/output means for establishing circuit connection with hardware components comprising motherboard, microprocessor, graphics processing unit, and memory storage, wherein said memory storage is installed with per-machine-based software comprising an OS;
(b) DI interfacing means in circuit communication with said input/output means, for obtaining IDs of said hardware components and/or said per-machine-based software, wherein said IDs refer to identification, identifier, identity, serial number and/or address; and
(c) control means for (i) setting which of said IDs to be selected from said hardware components and/or said per-machine-based software as DI information; and (ii) formatting said DI information into a form suitable for transmitting.