US 12,341,279 B2
Ball grid array card edge connector
Xiang Li, Portland, OR (US); Mo Liu, Santa Clara, CA (US); Shaohua Li, Pleasanton, CA (US); Jingbo Li, Portland, OR (US); and Kai Xiao, Portland, OR (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 16, 2021, as Appl. No. 17/202,961.
Prior Publication US 2021/0203094 A1, Jul. 1, 2021
Int. Cl. H01R 12/73 (2011.01); H01R 12/57 (2011.01); H01R 12/72 (2011.01); H01R 13/26 (2006.01); H05K 1/18 (2006.01)
CPC H01R 12/737 (2013.01) [H01R 12/57 (2013.01); H01R 12/721 (2013.01); H01R 13/26 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A card edge connector, comprising:
a housing having an opening into which a first circuit board is to be inserted;
pins, wherein an individual pin includes a first end and a second end, the pins extending from within the opening through a bottom surface of the housing, the first end of the pins to mate with a corresponding contact of the first circuit board, the pins formed in a row of first aligned pins and a row of second aligned pins opposite the row of first aligned pins, wherein:
at least a first portion of the pins of the row of first aligned pins and the row of second aligned pins are to couple with first corresponding conductive areas of a second circuit board to which heel-routed signal lines are connected, and
at least a second portion of the pins of the row of first aligned pins and the row of second aligned pins are to couple with second corresponding conductive areas of the second circuit board to which toe-routed signal lines are connected; and
ball grid array (BGA) solder balls, wherein an individual BGA solder ball of the BGA solder balls is at the second end of a corresponding one of the pins, the pins to mate with the first and second corresponding conductive area areas of the second circuit board to which the card edge connector mates via the BGA solder balls,
wherein:
the card edge connector is to be adapted to an edge portion of the second circuit board,
the second circuit board includes a motherboard,
the pins are connected to the motherboard through pads and routing traces,
the pads include the first and second corresponding conductive area areas, and
the routing traces are connected to the pads.