US 12,341,232 B2
Irreversible circuit element and method of manufacturing irreversible circuit element
Tomoyuki Sasaki, Tokyo (JP); and Yoshiaki Sato, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Appl. No. 17/917,738
Filed by TDK CORPORATION, Tokyo (JP)
PCT Filed Feb. 15, 2022, PCT No. PCT/JP2022/005912
§ 371(c)(1), (2) Date Oct. 7, 2022,
PCT Pub. No. WO2023/157069, PCT Pub. Date Aug. 24, 2023.
Prior Publication US 2025/0079676 A1, Mar. 6, 2025
Int. Cl. H01P 1/32 (2006.01); H01P 1/36 (2006.01); H01P 1/38 (2006.01); H01P 1/387 (2006.01)
CPC H01P 1/36 (2013.01) [H01P 1/32 (2013.01); H01P 1/38 (2013.01); H01P 1/387 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An irreversible circuit element comprising: a housing; a plurality of irreversible circuit plates accommodated in the housing; and a plurality of terminals connected to an outer surface of the housing,
wherein the plurality of irreversible circuit plates are arranged such that the adjacent irreversible circuit plates face each other,
each of the plurality of irreversible circuit plates includes a metal layer, a first insulating layer, a loss layer, and a first magnetic field applying layer laminated in sequence in a thickness direction,
each of the plurality of irreversible circuit plates transmits a signal irreversibly between a first end and a second end, and
the first end and the second end of each of the plurality of irreversible circuit plates are connected to different terminals of the plurality of terminals.
 
20. A method of manufacturing an irreversible circuit element, comprising the steps of:
forming a loss layer on an insulating layer, which is laminated on a metal layer, using a nanoimprint method and producing an irreversible circuit plate; and
connecting each of a plurality of irreversible circuit plates including the irreversible circuit plate to a terminal.