| CPC H01L 27/124 (2013.01) [G02F 1/136286 (2013.01); H01L 27/1288 (2013.01); G02F 1/136295 (2021.01)] | 9 Claims |
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1. A conductive pattern forming method comprising:
sequentially forming a release layer and a conductive layer on one side of a transfer substrate, the release layer being disposed between the transfer substrate and the conductive layer;
placing a mask on the other side of the transfer substrate;
irradiating first intense pulsed light (IPL) to a first surface of a substrate without a mask overlapping the substrate to heat the substrate, the first IPL being irradiated directly to the substrate without any other layer disposed between the first IPL and the substrate;
placing the transfer substrate on the substrate which is irradiated and heated by the first IPL without forming an additional layer on the substrate; and
transferring a portion of the conductive layer, corresponding to an opening of the mask onto the substrate by irradiating second IPL to the transfer substrate to form a conductive pattern on the first surface of the substrate,
wherein no portion of the release layer is transferred onto the substrate during the transferring the portion of the conductive layer.
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